(EAC)OLED Film Laser Cutting Equipment
The equipment utilizes laser to cut the entire flexible substrate (maximum size: 1500mm x 925mm) into cells of a specified size & number and then discharge them. The equipment comprises a substrate feeding unit, a laser cutting unit, a waste removal unit, a turntable unit and an unloading unit.
Equipment Advantages
  • 01
    Synchronous cutting with multiple laser heads to improve cutting efficiency
  • 02
    Utilize ultra-short pulse laser processing to reduce damage to the product
  • 03
    The hardware is independently developed and manufactured by Maxwell, which can guarantee the delivery and be convenient for customization and upgrading
  • 04
    Independent software development, friendly interface, unique multi-matrix fusion parallel algorithm
  • 05
    Equipped with cutting dust removal and product, platform cleaning function, and excellent particle removal effect
  • 06
    Equipped with the function of rework processing of abnormal pieces
Equipment Picture
Basic Parameters
  • 1. Applicable products : flexible OLED
  • 2. Applicable product size : 1~13 inches(25mmx25mm~300mmx300mm)
  • 3. Tack Time : ≤ 3S (95 pcs) based on 6 inches
  • 4. CO2 laser cutting accuracy : ≤±30?m
  • 5. UV laser cutting accuracy : ≤±30?m
  • 6. Coincidence degree : ≤ ± 15?m
  • 7. GP laser cutting accuracy : ≤ ± 30?m
  • 8. CO2 cutting unilateral heat influence range : ≤70?m
  • 9. UV cutting unilateral heat influence range : ≤40?m
  • 10. Green laser cutting unilateral heat influence range : ≤20?m
  • 11.
  • 12.
  • 13.
  • 14.
  • 15.
  • 16.
  • 17.
  • 18.
  • 19.
  • 20.
  • 21.
  • 22.
  • 23.
  • 24.
  • 25.
  • 26.
  • 27.
  • 28.
  • 29.
  • 30.